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3D Flash Memory “BiCS FLASH™”
KIOXIA delivers flash-based products for next-generation storage applications. Having invented NAND flash memory over 35 years ago, KIOXIA is now one of the world’s largest flash memory suppliers — and continues to move the technology forward.
KIOXIA BiCS FLASH™ Technology Is Leading the Way with Groundbreaking Architectural Innovation
KIOXIA BiCS FLASH™ generation 8 3D flash memory features 218 layers and CMOS directly Bonded to Array (CBA) wafer bonding technology, an architectural innovation that meets the needs of data-centric applications like advanced smartphones, PCs, SSDs and data centers. When performance, high density and cost-effectiveness matter, BiCS FLASH™ 3D flash memory delivers.
BiCS FLASH™ generation 8 Technology – Why CBA?
With CBA technology, each CMOS wafer and cell array wafer is manufactured separately in its optimized condition and then bonded together to deliver enhanced bit density and fast NAND I/O speed. Fabrication of the cell and peripheral separately enables optimization of each, eliminating the trade-off between cell reliability and I/O speed — and delivering a major leap in power efficiency, performance, density, cost-effectiveness, and sustainability.*1
Interview
High-density 3D flash memory using high-precision wafer bonding brings new value to storage
In recent years, flash memory manufacturers have focused primarily on developing technologies to increase the number of layers of memory cells and increase memory density. Each time a new generation of flash memory is released, the number of layers increases with some products boasting more than 200 layers. However, as Atsushi Inoue, Vice President of Memory Division at KIOXIA, explained, "Increasing the layers of memory cells is only one way of increasing capacity and memory density, and we are not exclusively preoccupied with the number of layers."
BiCS FLASH™ Technologies
Key Features*
High storage density per die than conventional flash memory
High read/write speed performance
High reliability than 2D (planar) NAND
Low power consumption
* Compared to 2D planar technology
Target Applications
Data Center Efficiency
BiCS FLASH™ 3D flash memory was designed to address the most challenging data center issues:
Principle of 3D Flash Memory Operation
The principle of 3D flash memory operation is explained with CG (computer generated) animation by contrasting it to the way the sun shines (in Japanese with English subtitles).
KIOXIA Scalable BiCS FLASH™ 3D Flash Memory Technology Boosts Memory Capacity to Highest Level Yet Achieved*2
TLC (Triple Level Cell) and QLC (Quadruple Level Cell) Technology
BiCS FLASH™ 3D flash memory product lineup includes both 3-bit-per-cell (TLC) and 4-bit-per-cell (QLC) technology. QLC technology significantly expands capacity by pushing the bit count for data per memory cell from three to four. A capacity of 4 terabyte (TB) can be achieved in a single package using BiCS FLASH™ QLC technology in a 16-die stacked architecture.
Leading the Drive Toward Greater Memory Density and Efficiency
KIOXIA was one of the first industry players to envision and prepare for the successful migration of SLC technology to MLC, from MLC to TLC, and now from TLC to QLC.
KIOXIA QLC technology is ideal for applications requiring high density, lower cost storage solutions. Today’s QLC reduces the footprint with the highest density available in a single package enabling storage solution to scale.
- Features and typical use performance improvements as compared to the previous generation of BiCS FLASH™ 3D TLC flash memory.
- Source: KIOXIA - July 3, 2024 press release
Products by Applications
Whether it’s automotive applications or compact high performance-oriented PCs or cloud server and hyperscale data center deployments, by delivering advanced high performance, high density, low power, low latency, reliability and more—KIOXIA memory and storage solutions enable the success of emerging applications and allow existing technologies to reach their expected potential.
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Support
Please contact us if you have any technical questions, requests for materials, are interested in samples or purchases of business products (Memory, SSD), etc.
In 2007, KIOXIA announced the world‘s first 3D flash memory technology. Presenting our cutting-edge technologies, along with the key points of innovation and our efforts toward further increases in capacity.
KIOXIA invented the world’s first NAND flash memory in 1987. This is an explanation of the structure of flash memory and the mechanism of data storage.
