Toshiba Acquiring Land for New Semiconductor Production Facility

TOKYO—Toshiba Corporation (Tokyo: 6502) today announced that it is gearing up for future expanded production of “BiCS FLASH™”, its proprietary 3D flash memory, by acquiring 150,000m² of land adjacent to its Yokkaichi Operations memory production complex in Mie prefecture. The land borders the eastern and northern parts of the complex, and will cost approximately 3 billion yen.

The new site is expected to be ready for construction by March 2017. Decisions on construction schedule, production capacity, and equipment investment for the new production facilities will be made in line with market trends within FY2016.

NAND flash memory is a driving force in data storage, with applications range from extensive use in smartphones, tablets and other personal digital equipment to an increasingly important role in enterprise computing and datacenters.　Production of BiCS FLASH™ requires a new cleanroom with dedicated equipment for the 3D process. The New Fab 2 building, which will be fully completed in the first half of FY2016, will initially provide this space.

The land Toshiba is now acquiring will provide a site for future construction of an additional clean room for 3D flash memories adjacent to the current site, which now has limited space due to current facilities. This increased capacity will position Toshiba to quickly respond to the approaching transition from 2D to 3D flash memories, when market trends indicate the need for a new facility.

Toshiba positions the memory business as a core business, and will continue to make focused investments that enhance its market competitiveness.