Toshiba Memory Corporation Launches e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASH™ 3D Flash Memory

  • February 27, 2019

TOKYO—Toshiba Memory Corporation, the world leader in memory solutions, today announced that it would begin sampling new JEDEC e-MMC Ver. 5.1[1] compliant embedded flash memory products utilizing BiCS FLASH™ 3D flash memory for consumer applications in the end of March.

e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASH™ 3D Flash Memory

e-MMC products are embedded flash memory products integrating flash memory chips and a controller in a single package.
The company will continue to reinforce its market-leading position by adding BiCS FLASH™ 3D memory embedded products to its lineup of flash memory products.

Key Specifications

Interface

JEDEC e-MMC Ver. 5.1 standard
HS-MMC interface

Density

16GB, 32GB, 64GB, 128GB[2]

Power Supply Voltage

2.7 to 3.6V (Memory core)
1.7V to 1.95V (Interface)

Bus Width

×1 / ×4 / ×8

Temperature Range

-25℃ to +85℃

Package

153Ball FBGA
11.5mm × 13.0mm

Lineup of the New Products

Product Name Capacity
 Package Mass Production  
THGAMRG7T13BAIL 16GB 11.5×13.0×0.8mm 3Q, 2019 (Jul.-Sep.)
THGAMRG8T13BAIL 32GB 11.5×13.0×0.8mm
THGAMRG9T23BAIL 64GB 11.5×13.0×0.8mm
THGAMRT0T43BAIR 128GB 11.5×13.0×1.0mm

Notes
[1] One of the standard specifications of embedded flash memory defined by JEDEC. The new product also supports the command queuing and secure write protection functions which is specified as an option in JEDEC e-MMC Ver. 5.1.
[2] Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications.

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Customer Inquiries:
Memory Marketing Division
https://apac.kioxia.com/en-apac/contact.html

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.