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Client NVMe™ SSD

KIOXIA BG5 Series is a line-up of compact form factor NVMe™ SSDs with capacities up to 1,024 GB, and leverages a PCIe® 4.0, NVMe™ 1.4 specification compliant interface and KIOXIA 112-layer BiCS FLASH™ 3D TLC (3-bit-per-cell) flash memory. With higher bandwidth, improved flash management and Host Memory Buffer (HMB) technology, the BG5 Series SSDs deliver best-in-class read performance for compact form factor SSDs of up to 3,500 MB/s (sequential read) and up to 500K IOPS (random read), with active power consumption of up to 4.3 W (Typ.)*.

The BG5 Series SSDs are available in capacities of 256 GB, 512 GB and 1,024 GB in M.2 Type 2230 and Type 2280 module form factors, making them suitable for thin and light system designs, such as ultra-thin PCs. The BG5 Series offers a Self-Encrypting Drive (SED) model option, supporting TCG Opal Version 2.01.

  • As of November 2021, KIOXIA survey.


Key Features

  • KIOXIA 112-Layer BiCS FLASH™ 3D TLC flash memory
  • PCIe®4.0, NVMe™ 1.4 specification compliant
  • Capacities up to 1,024 GB
  • M.2 Type 2230 and Type 2280 single-sided form factors
  • TCG Opal 2.01 SED option

Key Applications

  • Ultra-mobile PCs
  • 2-in-1 notebook PCs


* Table can be scrolled horizontally.

Capacity1,024 GB512 GB256 GB1,024 GB512 GB256 GB
Basic Specifications
Form FactorM.2 2230-S2 Single-sidedM.2 2280-S2 Single-sided
lnterfacePCIe® 4.0, NVMe™ 1.4
Maximum Interface Speed64 GT/s (PCIe® Gen4 x4)
Flash Memory TypeBiCS FLASH™ TLC
Performance (Up to)
Sequential Read3,500 MB/s3,400 MB/s3,500 MB/s3,400 MB/s
Sequential Write2,900 MB/s2,700 MB/s1,900 MB/s2,900 MB/s2,700 MB/s1,900 MB/s
Random Read500K IOPS400K IOPS350K IOPS500K IOPS400K IOPS350K IOPS
Random Write450K IOPS430K IOPS360K IOPS450K IOPS430K IOPS360K IOPS
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Active)4.3 W typ.4.1 W typ.4.0 W typ.4.3 W typ.4.1 W typ.4.0 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
MTTF1,500,000 hours
Thickness2.23 mm Max
Width22 mm ± 0.15 mm
Length30 mm ± 0.15 mm80 mm ± 0.15 mm
Weight3.0 g Max2.9 g Max2.8 g Max6.0 g Max5.9 g Max5.8 g Max
Temperature (Operating)0 ℃ to 95 ℃ (Controller Temperature)
Temperature (Operating)0 ℃ to 85 ℃ (Other Components Temperature)
Temperature (Non-operating)-40 ℃ to 85 ℃
Humidity (Operating)0 % to 90 % R.H.
Vibration (Operating)196 m/s2 { 20 Grms } ( 20 Hz to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • 1 MB (megabyte) = 1,000,000 bytes.
  • IOPS: Input Output Per Second (or the number of I/O operations per second).
  • Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size.
  • Read and write speed may vary depending on various factors such as host devices, software (drivers, OS etc.), and read/write conditions.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • TBW: Terabytes Written. The number of terabytes that may be written to the SSD for the specified lifetime.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of third-party companies.
  • All information provided here is subject to change without prior notice.



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